Multilayer Printed Circuit Boards: An Essential Component for Smart Wearables

Key takeaways:

• Introduction
• Recent trends and innovations in the industry
• The competitive scenario in the sector

Printed circuit boards are the most important functional components used in the semiconductor manufacturing and fabrication industry. A laminated sandwich structure of conductive and insulating layers, the PCB is used to connect different electronic components in a circuit. Almost all modern electronic gadgets use PCBs because they are cheaper and easier to mass-produce than other wiring options.

The efficiency and efficacy of any electronic and electrical device, thus, depends on the working of these PCBs and the components installed on these boards. As the complexity of smart gadgets has increased over the years, the density of transistors, diodes, and capacitors embedded in these PCBs has increased drastically. Since the dimensions of the printed circuit boards cannot be increased beyond a certain limit, multilayered PCBs have emerged which help companies to manufacture high-performance electronic devices. These circuits have two or more conductive foil layers which are laminated and glued together using heat-protective insulating materials.

Increasing preference for multilayer PCBs reshaping industry dynamics

The growing trend of miniaturization of electronic devices is expected to help the multilayer printed circuit board industry gather a revenue of $116.1 billion by 2032. The market accounted for $71 billion in 2023 and is estimated to surge ahead at a CAGR of 5.5% during 2024-2032. Over the past few decades, the size of consumer electronic goods such as smartphones, laptops, and tablets has been decreasing due to growing demand for lightweight and portable gadgets. This transition has increased the utility of multilayered PCBs as they help businesses develop circuits that fit into these devices, without compromising on their performance and functionalities.

Additionally, these PCBs are lightweight yet highly durable, making them ideal for smart wearables and other such gadgets. The advanced insulation materials used in these multilayer printed circuit boards increase their resistance to heat and pressure, thereby helping them perform at great speeds even in adverse conditions.

In the last few years, the emergence of IoT and edge computing has surged the demand for multilayer printed circuit boards due to their ability to perform complicated tasks easily. For instance, the growing integration of IoT-powered tools into electronic gadgets has necessitated the installation of communication protocols such as CoAP and MQTT. The addition of multiple new components on an already-crowded circuit has elevated the utility of multilayer PCBs. Similarly, many ICT companies are developing specialized edge computing machines that feature several multilayered printed circuit boards to fit various microcontrollers, diodes, microprocessors, and transistors easily.

M&A deals and product launches driving the growth of the sector

Along with the innovations in the multilayer printed circuit board industry, the strategic alliances established by major companies have also contributed to the growth of the sector. For instance, in February 2024, Renesas Electronics Corporation, a semiconductor solutions supplier, announced that it had signed a definitive agreement to acquire Altium Limited, an electronic device designing company. Over the last few years, Altium Limited has gained a reputation for its high-quality multilayer PCB designs which are widely used by different electronic goods manufacturing businesses. The acquisition by Renesas Electronics Corporation is expected to expand its product portfolio and boost its revenue share in the coming period.

On the other hand, many enterprises have launched innovative products to cater to the evolving consumer demands and increase their footprint in the industry. In October 2024, for instance, AGC Inc., a Japanese flat glass manufacturing company, introduced METEORWAVE® ELL Series of Multilayer PCBs, specifically designed for high-communication applications. These new solutions offer high data transmission rates which make them ideal for IoT and generative AI applications. Furthermore, the power consumption of these new PCBs is quite lower compared to traditional circuits, thus lowering the carbon emissions caused by advanced computing processes.

Winding up, the growth of the multilayer printed circuit board industry is attributed to the increasing use of smart devices and electronic gadgets by people across the globe. Moreover, the trend toward miniaturization of circuit boards has played an important role in the rise of the sector. In addition, the advent of emerging technologies such as IoT and edge computing is anticipated to create numerous investment opportunities in the market in the near future.

Contact our experts for the upcoming trends and latest developments in the multilayer printed circuit board market!

Related Post