Reasons Why 3D Semiconductor Packaging is Preferred over Other Packaging Technologies

With the growing use of mobile and other electronics devices, the expectations for high product performance have naturally soared up to a significant extent. And, with this drift, the use of 3D components has also cropped up to meet those prospects.  Paired with several challenges to steer through, this high-end packaging technology of semiconductor chips in which layers of active electronic components are piled together enables two or more devices to work as a single piece of tool. Along with reduced space consumption, 3D semiconductor packaging technology gives way to enhanced efficiency as well as an overall better performance, thereby taking over other advanced packaging technologies.

Integrating heterogeneous semiconductor technologies into micro-electronic modules, 3D semiconductor makes these modules empower miniaturization which can be solicited in handy microelectronics systems such as several bio-medical solutions, sensors and smart phones. These units can also be well-applied in big-size computing systems including super computers and servers. Also, when it comes to product application, 3D technology helps in more than one way. Right from increasing bandwidth to perking up performance, and reducing cost, 3D semiconductor packaging can be a perfect cohort.

Companies working on this technology happen to propel the required design and 3D assimilation technology solutions to shore up its multiple generations. Module integration, power delivery, bond, assembly and several thermal as well as cooling solutions are taken recourse to in order to pave the way for high-end outcomes. Moreover, during the course, they build test hardware to improve processes and delineate rules that can be utilized in parallel device node for future built-up apps that support the concerned venture and its worldwide customers.

The 3D semiconductor packaging market trends which make way to the matchless growth in 3D semiconductor packaging industry take in its exclusive benefits over other packaging technologies. Also, heightened efficiency and lower cost associated with this pioneering tech have driven the growth. In 3D Through Silicon via (TSV) technology, the perpendicular links are made through silicon die, and as compared to 2D technology, the intersect length gets condensed to a significant extent, especially where the connections are flat. The technological benefits of 3D packaging spur its demand in top-end applications for example, NAND, microelectronic circuits, DRAMS etc. These benefits have led, 3D semiconductor packaging market toward gaining a lot of potential to rise.

According to Allied Market Research, the global 3D semiconductor packaging market is expected to grow at a significant CAGR from 2016-2022. Increase in number of portable electronic devices, rise in demand of miniaturized circuits in microelectronic devices and technological superiorities over 2D packaging technology have fueled the growth. On the other hand, high initial capital investment required to set up a plant and thermal issues with devices have happened to curb the growth to some extent. However, growing trend of Internet of Things (IoT) has almost downplayed the factor and created multiple opportunities in the segment.

To conclude, we can state that the global 3D semiconductor packaging market is growing quite profusely and in the next few years to come, it’s going to give its contenders a tough competition indeed.

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