Innovations and Rapid Partnerships to Support the Future of Advanced Packaging

Advanced packaging technology has evolved since its invention to reduce costs and improve the overall throughput and performance of integrated circuits. In advanced packaging, a tiny block of materials is coated in a supporting casing during the last phases of semiconductor development to minimize physical damage and corrosion. Advanced packaging technology is linked to a rise in the functional density of large system-on-chip solutions.  

Numerous factors can impact the growth of the global advanced packaging market. The rise in deployment of semiconductor integrated circuits in automobiles and increase in consumer demand for smart and power-efficient devices, as well as exponential adoption of the Internet of Things (IoT) by various business verticals drive the growth of the global advanced packaging market. As per the report of Allied Market Research, the global advanced packaging market is projected to reach $64.19 billion by 2027, growing at a CAGR of 10.2% from 2020 to 2027.

New product launches and partnership deeds:

Companies often undertake several strategic decisions to strengthen their market presence. For instance, Texas Instrument, a global semiconductor company acquired Micron Technology’s semiconductor factory. This acquisition will offer a competitive advantage to Texas Instrument in production and this is a part of its long-term capacity planning.

Furthermore, Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled its latest innovation in advanced logic technology along with TSMC 3DFabric system integration solution. This advanced packaging and chip stacking technology provide safety and high bandwidth memory integration for high-performance computing applications. Moreover, it allows larger floor plans for chiplet.

Samsung, a South Korean multinational conglomerate company, has launched a new advanced chip packaging technology named I-Cube4, which is said to offer an improved level of communication and power efficiency between logic and memory. The chip could be used for high-performance computing, 5G, artificial intelligence (AI), cloud data centers applications.

Opportunities in the future:

The advanced packaging market is expected to grow significantly in the future years due to its low cost, more storage capacity, and more protection compared to conventional packages. Due to rise in technological innovation and collaborations of several market players in the field of advanced packaging, advanced packaging has made its way in the industries such as healthcare, automotive, consumer electronics, aerospace, and military. As the automobile is the primary industry that heavily relies on advanced packaging, it creates even more excellent opportunities for the participants in the advanced packaging market.

What’s more, the spread of 5G technology across the world benefits the demand for advanced packaging. The 5G chipsets like the radio frequency integrated chips (RFIC) are designed using advanced packaging technology, allowing them to achieve excellent performance, compact size, and low power consumption in 5G-enabled products. Several companies such as Ford and General Motors have been working on manufacturing automotive solutions with the use of advanced packaging technology.

The surge in the adoption of artificial intelligence (AI) is the greatest opportunity for the advanced packaging industry. Moreover, improvements in the supply chain and advancements in the field of advanced packaging will drive market growth in the future. With the technological advancements in advanced packaging, it has surely a bright future in the coming years.

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